The newest optical devices integrate waveguides, fiber arrays, planar optical circuits (PLC and PIC) and various WDM chips. Packaging these components demand specialized equipment capable of processing miniature connectors, optical substrates and bare fiber. Selection 2: Optical chip types: VCSEL, DFB, EML, narrow linewidth tunable. Each option is directly related to certain performance requirements of the product and is strongly correlated with the final product's reliability, cost, and other factors. The competition in the optical industry involves. Co-Packaged Optics (CPO) is a technology and design approach where optical components, such as lasers and photodetectors, are integrated alongside electrical components, like Application-Specific Integrated Circuits (ASICs), within the same package. We deliver end-to-end precision packaging solutions from design to mass production. Leveraging advanced materials and automated processes, our products ensure superior optical signal integrity and long-term. High speed optical transport systems, from submarine to FTTX, are powered by cutting edge photonic transmission and networking components. Co-Packaged Optics is a cutting edge technology that is gaining traction due to the increasing demand for higher data rates and lower power consumption in data centres, AI / ML accelerators and high-speed.